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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 25, 2013

Steve Twitchell, Vice President, PRIDE Industries

Though we usually read otherwise in these commentaries, a poor growth year unfortunately does not automatically mean an inevitable rebound...especially since all the fundamentals contributing to the lackluster 2012 just ending remain the same, and the underlying debt and massive borrowing continue unabated.



That aside, 2013 could still be interesting. US manufacturing should remain a headline topic, though hopefully now stripped of the political rhetoric that blurred the discussion all of last year. Even beyond electronics assembly, which will hopefully benefit from some measured review of the last decade's headlong China exodus. For instance, 3D additive manufacturing equipment promises to soon hit a price point that makes the processes available to small innovators... and quickly open new doors to game changing ideas.

Steve Twitchell
VP, Business Development & Service Operations, PRIDE Industries
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
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Affordable Profiling