Although 2012 witnessed a slowdown in the entire technology sector with sluggish growth in both electronics assembly and semiconductor markets, we expect the market to rebound during the 2nd quarter of 2013, fueled by the dramatic shift towards smart phones, tablets and automotive sectors.
During this slowdown, we have invested in strengthening our SPI and AOI product suites to create more robust, quality inspection solutions. On the SPI front, we have the SE500ULTRA(TM) system with an optional dual illumination sensor for improved accuracy and 30% faster inspection speed with unique all-in-one scan. In the pipeline for AOI is the QX600(TM) system designed with an all-new sensor with higher resolution for 01005 inspection and improved LED illumination for reliable solder joint and gold finger inspection while reducing shadow and reflection effects.
Enhancing the user experience of our products is our top priority which is evident from various projects that are underway to drastically reduce programming time with one-step programming solution -- ePM-SPI/AOI, further simplify programming to make it easier to learn and use with AI2 technology and a brand new interface packed with an intuitive design and powerful features.
The CyberOptics team also is focused on increasing yields with its key initiatives such as closed loop feedback/feed forward program with leading printers and mounter vendors to optimize the screen printing process and CyberConnect feature for AOI-SPI correlation analysis for effective traceability of defects.
We look forward to an exciting 2013 with a great line-up of new products, user experience enhancements and value-add solutions to offer.
