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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 29, 2013

Andy C. Mackie, Ph.D., Senior Product Manager, Indium Corporation

The forecasts for many markets around the globe call for a steady climb upward and we are poised to meet the increased demand for technically advanced solder products. The LED lighting, mobile computer device, automotive, renewable energy, aerospace, and the electronic industry in general continue to demand very robust solder assembly materials, and we will continue to fulfill these needs. 


We are also ready for the 2014 medical-device RoHS deadline and offer lead-free conversion expertise and products for customers worldwide. We have made considerable investments into R&D to produce additional high performance products along with improving our existing line-up.


We believe that our expertise and value-add philosophy to customer service and support is what makes AIM an industry leader. We may be large firm with a global reach but we still operate as the hands-on, family-run business that we are by offering personalized local support.


Our plant in Mexico is relocating to a nearby modern manufacturing facility which will be three times of the current one and is currently being outfitted with the latest high-efficiency manufacturing systems. This will better serve our customer demands in that region. Also in 2013 we are going to significantly expand AIM's presence in Eastern Europe.

Andy C. Mackie, Ph.D
Senior Product Manager, Semiconductor and Advanced Assembly Materials, Indium Corporation
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling