Throughout 2012, Digicom planned, invested in, and implemented large-scale improvement goals to enhance capacity and productivity, while maintaining or improving the high quality standards that have always been the hallmark of Digicom manufacturing practices. Selective soldering equipment, in an inert, Nitrogen environment, was installed to improve throughput while achieving solder joint quality at "preferred target" IPC-610 standards.
To ensure our high quality objectives and goals, we added the most advanced, laser equipped optical inspection machine, with multiple side-angle camera vision that captures even minor defects and compiles statistics that are extracted and monitored. The last mile, critical to high reliability PCBAs, was the design and implementation of a wash process that enables Digicom to achieve levels of cleanliness far above expectations, based on IPC-TM-650 standards.
Digicom expects, and is poised to embrace, an estimated 30-35% expansion in business opportunities projected for 2013. This is based on current and potential clients who have witnessed Digicom's manufacturing process, along with the technical expertise and high level of service and collaboration of Digicom's team, and have promised cooperation and increased activity. With made-in-the-USA policy that includes procurement of US source supplied parts, Digicom continues to fulfill expectations of high end quality products.
