Peter Bierhuis, President, Nordson ASYMTEK

Practical Components expects to continue our steady growth in 2013. We have seen a solid increase in the adoption of our technologies because of the enormous cost savings that they produce and the improved production quality levels they achieve.

2012 saw a number of new products that we will continue to develop in the coming year. In our lineup of new components notably are the .3mm pitch CVBGA, Ewlp and the CSPnl Wafer Level Packages. We continue to see a wider adoption of the Amkor TMV PoP as well other advanced components.

Solder Training Kits and Evaluation PCB Boards still represent a significant source of savings for our customers. There is a strong ongoing demand for our B-52 Ionic Cleanliness Test Kit as well as hand solder training kits. There is increasing demand to train to all the IPC standards such as the J-STD-001E, 7711/7721 and we continue to develop kits to cater to this market.

2013 also will see a number of fresh Evaluation Boards including an upcoming Jabil solder paste evaluation board and kit.

In the past year we have continued to improve our operating technologies as well as investing in our employee core proficiencies creating a more efficient and responsive team. In the coming year we will be doing additional training and system improvements to extend those same benefits to our international distributors and customers.

Overall we look forward to a strong a prosperous 2013.