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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 4, 2013

Stan Renals, CEO Cobar, Balver Zinn Group

Market conditions in North America were moderately down the second half of 2012 as political, financial and market concerns kept customers cautiously optimistic.



Fuji America Corporation is looking forward to improved market conditions in 2013 as the elections and fiscal cliffs are now behind us allowing our customers to focus on their own needs.



Another contributor to an optimistic outlook is the thousands of older SMT placement machines that still remain operational in the North American market. These platforms are increasingly costly to operate & maintain and are highly inefficient and technologically obsolete.



The trend to move into smaller package sizes such as 0201, 01005 and Package on-Package will increasingly require these vintage machines to be replaced by new, more efficient and technologically superior models. This combined with growing consumer confidence in the overall market and a new on-shoring trend due to higher labor costs in Asia, should push North American sales of new equipment higher over the next twelve months.



Fuji America looks forward to the introduction of our latest high mix, low to medium volume solutions, as well as other high technology solutions, at the upcoming Apex Expo in San Diego CA.

Stan Renals
CEO Cobar, Balver Zinn Group
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling