Cost pressure on electronics manufacturers is increasing, while environmental trends are boosting demand for lead-free solutions. Growing interest in halide-free solder pastes will require new formulations, and the continuing miniaturization of electronics will require ever smaller and more precise solder joints.
The photovoltaics industry should face a challenging year, marked by decreasing demand and overcapacity. Those manufacturers who can provide innovative solutions and the highest cell efficiencies will stay ahead of their competition.
The mobile electronics and smart phone market will remain strong. MEMS manufacturers will see continuing growth as new MEMS are developed and the number of MEMS in smart phones increases. The main challenges will be the ongoing miniaturization trend and consumer demand for environmentally friendly electronic products.
Nordson EFD is supporting these manufacturers with dispensable solder pastes in a wide range of lead-free alloys, from the industry standard SAC305 to specialty lead-free alloys with high melting points, for processes where components must withstand a secondary reflow process. We can also supply alloy particle sizes as small as Type 6 to facilitate miniaturization, along with newly formulated halide-free pastes that satisfy environmental requirements while providing good wetting.
