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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 6, 2013

David Raby, President/CEO, STI Electronics

We expect slow but steady growth in the semiconductor market and other tech sectors with stronger growth in the LED and printed electronics market segments. Solar installations will continue growing but manufacturing will struggle with restructuring and consolidation in 2013 due to overcapacity.


We see great potential in emerging photovoltaic technologies including back contact MWT, IBC and HIT module designs. Thin film is struggling but the stronger, more innovative players should survive and prosper over time, especially those involved in BIPV.



Engineered Materials Systems, Inc. (EMS) and Engineered Conductive materials, Ltd.(ECM - now a product line) were acquired by Nagase & Co., Ltd. in January of 2012. Integration of the EMS/ECM business into the Nagase global business has been progressing quite well and we have been developing and implementing a global marketing and sales strategy to leverage the strengths of the two organizations.



 



In 2012 we opened a new manufacturing facility in Delaware, Ohio to accommodate our expanding electronic materials business in the printed electronics, semiconductor and solar markets.



In 2013 we expect to continue adding staff to our Research & Development, Manufacturing and Quality Assurance groups to support new business and new business development opportunities. Overall we expect to have a great year with strong sales growth across our core markets.

David Raby
President/CEO, STI Electronics
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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