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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 7, 2013

Roy Amri, VP of Sales, Absolute Turnkey

I am cautiously optimistic for 2013 however STI is prepared for a slightly worse version of 2012. We are hoping that the pessimism that seems to be gripping the nation will break and the economy as a whole and particularly the electronic manufacturing business will improve dramatically.


At STI, we have continued to invest in people and technology all designed to improve our quality, decrease our reaction time and increase our knowledge base. In addition, STI has developed new lesson plans and curriculum for industry training programs and have more on the schedule for the first 2 quarters of 2013. Geographically, we've expanded the footprint of our training offerings based on customer requests.


We have added technology in our manufacturing facility that gives us the capability of
assembling and manufacturing more complex hardware while increasing efficiencies and power requirements and at the same time decreasing size and weight. All of these are major concerns for customers and their hardware designs.


Our electronic assembly and solder supplies group has been working diligently to increase ease of ordering whether by phone, fax, email or e-store while decreasing costs and ship times. We also have a couple of new product/service offerings that you will hear more about as 2013 progresses.

Roy Amri
VP of Sales, Absolute Turnkey
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling