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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 8, 2013

Mark Brawley, Vice President, Americas�, Speedprint Technology

In 2013, ECT's ET (Electrical Test) Group will introduce new products from each of its product lines. Each new product technology is designed to leverage ECT's core technology with next-generation innovations, to continually improve existing products, and to deliver high-performance value-adding customer solutions.



Atg-LM introduces the new A7 which offers world class high-speed prober test capability with amazingly high-accuracy. The double-sided prober features eight test probes and 4 high-resolution XGA color cameras for optical scanning of PCBs. Atg-LM also offers newly improved products with the A5 Neo for economical prober test and the LM800 Octal-density grid tester with 4-wire Kelvin resistance measurement capability.



The ECT Fixture Services Group (FSG) introduces Tilt, a test solution that provides a highly flexible testing platform with 60-70% lower cost ATE fixtures and programs delivered faster. The Tilt solution is designed to support high mix / low volume production testing for new product introduction challenges as well as backplane board test capability and high pin count board testing with up to10,000 test points.



ECT's Contact Products Group (CPG) introduces its revolutionary new Edge product line featuring "flat" plunger technology with 10X's sharper tips that are ideal for via testing or OSP covered pads. ECT's Compliant Connector Solutions (CCS) group offers custom design, patented technologies, and turnkey solutions for today's compliant connector customer's needs.



We anticipate the Electronic Assembly and Test industry to remain challenging but healthy in 2013. We see growth opportunities in the coming year as we launch many new products that add more flexibility, higher performance, and greater value for our customer's in today's demanding marketplace.

Mark Brawley,
Vice President, Americas', Speedprint Technology
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling