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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 11, 2013

Terry Heilman, President & CEO, Sunstone Circuits

I believe overall the global economy will see modest growth in 2013. Cost cutting will be a major focus for many companies and reducing manufacturing cost will be the main driver.



In recent months we have received similar inquiries from our customers asking for products that will help them increase productivity and efficiency. To meet these new challenges in 2013, Techcon Systems have recently launched a new high speed Jet valve to boost productivity and cost savings. In addition we are working on new volumetric dispensing valve and precision dispenser that will dispense fluid accurately and consistently.



On the sales and marketing side, we are continued expanding in Asia. We will add more sales channels and hire more regional sales staffs and application engineers. At the same time we are planning to penetrate more in the Medical Device and Aerospace industry. Overall Techcon Systems team is optimistic to have a strong 2013.

Terry Heilman
President & CEO, Sunstone Circuits
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling