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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 13, 2013

Chetan Shah, President & CEO, Flex Interconnect

After a strong 2011 and a quick start in 2012, we saw a pull back with global financial concerns and yet another year of uncertainty both in the electronics industry and the global economy as whole. 2012 mustered some energy in Q4 but still saw a good amount of purchasing push off until 2013.



2013 like the beginning of 2012 is full of potential with several of the orders we saw push of in Q4 2012 immediately back in the hunt for Q1 2013. This leaves us projecting a strong 2013.

We will continue to differential ourselves with vapor phase innovation and the strongest most knowledgeable vapor phase team in the world. We have a few new innovations planned for implement across our product line this year making our equipment even more cost effective to run and delivering our lowest cost of ownership ever.



We will continue to push into new markets with both our vapor phase reflow and rework systems as we continue to educate the industry on both of these processes.

Chetan Shah, President & CEO, Flex Interconnect
Flex Interconnect
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling