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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 14, 2013

Jeff Mogensen, GM, Parmi USA

2012 was a growth year for Flex Interconnect Technologies (FIT). With all the uncertainties in the world market as well as election year, there was a slowdown in the business that was felt by the Printed Circuit Industry. Fortunately we were able to win many new programs and ending the year with nearly 10% growth.

FIT is now offering Samtec's standard high-speed Data Link flex cables, build to exact Samtec specifications, materials and processes. This product line offering in 2012 is one of the contributors for our growth. Along with this new standard flex cable line, FIT also designs, manufactures and assembles custom flex and rigid-flex technology to both IPC-6013 class 3 and Mil-P-50884 specifications.



The outlook for 2013 is very bright for FIT with the acquisition of a lot of new Military, Aerospace, Medical and Commercial customers during 2012. FIT invested in new equipment, made improvements in operating efficiencies and hired 15% more employees during 2012. This has helped increase the capacity by 30% to support the growth we expect to see in 2013.



FIT is AS9100C, ISO9000-2008, FDA QSR 820B and ITAR certified. FIT is capable of producing reliable prototypes from Schematics to complete Turnkey Assembly in 10 days or less, while meeting stringent quality and traceability requirements.



With our manufacturing capabilities and top-notch engineering expertise, we feel we are well positioned to support the needs of customers who demand top quality, excellent service at a rapid speed. We look forward to a great 2013.

Jeff Mogensen
GM Parmi USA, Parmi Co. Ltd.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling