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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 14, 2013

Dave Doherty, Digi-Key Corporation

At Parmi we see the SPI side of the business really taking some revolutionary steps over the next couple of years. The technology moves well beyond that of a 'good board - bad board finder'.


Sure SPI inspection technologies will continue to evolve, pushing the limits of speed and resolution but new levels of machine intelligence will really increase ROI and customer competitiveness on a global scale, and simply make a process engineer's 'day in the life of' easier.


In addition to new technologies, Parmi is pleased to announce the opening of our new technology center located in Boston. With experienced process experts like Joe Perault and John Morini, the facility delivers a whole new level of support services from a SPI supplier. Also, we are working very closely with more than a dozen industry neighbors like DEK, EKRA, Panasonic and Speedline to deliver closed-loop integrated solutions.


We are confident in our abilities to support our customers with state-of-the-art technology and the highest levels of support. With SPI demand increasing, we are well positioned for the year ahead.

Dave Doherty
Digi-Key
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling