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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 15, 2013

Marc Peo, President, Heller Industries

Laser cut stencils have improved in quality and capability over the years due to advancements in laser technology and the core materials available. We are, however, seeing a continued and increasing requirement for higher end stencils which are either hybrid technologies with various coatings or, ultimately, fine resolution electroform stencils with ultra-smooth aperture walls.



There is a strong market for the more commoditized and economical laser cut stencil, but for the more challenging applications and finer aspect ratios, high end electroform technology always wins through.



Photo Stencil has been the industry leader for many years, but to meet these challenges we have invested heavily in R&D as well as in expanding our fully equipped lab and engineering support. We continue to innovate for the electronics assembly market, and our broad offering of laser cut, chemical etching, coatings, and our core proprietary electroform process allows us to deliver some very unique products.




Throughout this year we will continue to recruit personnel, specifically in the area of process engineering/R&D to support customer applications. As well as this, I am exploring growth opportunities for Photo Stencil through potential acquisitions of companies with strong synergy to our core business.

Marc Peo
President of, Heller Industries
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling