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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 18, 2013

Eric Roiter, President, M.E. Baker Company / Baker Solar Inc.

In 2013 Semblant plans to change the environment associated with electronics manufacturing. While the current materials associated with PCB surface finish or PCBA conformal coating can be hazardous to the environment, Semblant will use its nanomaterials technology to create materials that are environmentally friendly and cost effective in terms of manufacturing costs.



From its inception Semblant has been a technology leader. Semblant's scientists and process engineers understand not only how to develop high performance nanomaterials, but also how to deploy the nanomaterial processes in high volume, low cost manufacturing. Semblant has created 22 different materials that have varying performance attributes that
can be used independently or together to solve customer challenges.



One of the Semblant's greatest differentiators is its alignment to each member of the electronics value chain -- collaborating with OEMs, contract manufacturers and PCB fabricators to insure the nanomaterial attributes and nanomaterial manufacturing process are practical, cost effective and able to support high volume manufacturing reliably. In 2013, Semblant plans to continue to this strategy of collaboration throughout the global electronics supply base, with an eye to improving the electronics manufacturing environment.

 
Eric Roiter
President, M.E. Baker Company / Baker Solar Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling