Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 6, 2014

Zach Shook, Operations Director, Count On Tools, Inc.

Overall, 2012 was an outstanding year for Microtronic! We booked orders beyond our initial expectations, and expanded our workforce by 30 percent. Looking forward, I know that many suppliers have cool things in their pipelines for 2013, and overall we are optimistic for another great growth year.

So far in 2013 we have already gained some new business and are working on some more great deals. Additionally, we plan to roll out a new software version for our BLT210 Solderability Testers. We will have a big presence at the SMT Hybrid Packaging Show and look forward to seeing everyone there!

Zach Shook
Operations Director, Count On Tools, Inc.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura