Rapid Tooling, Inc. is very excited about 2014. We have added new capabilities in 2013 and will continue to upgrade in 2014. We plan to add very high speed spindle machining centers with ultra-high repeatable accuracy. Additionally, we continue to add to our software suites in a continuing effort to produce tooling for our customers in the shortest possible time frame. We will add to our growing staff in the next 12 months. Our plans include adding captive plating and sheet metal fabrication capability.
2014 will bring a number of changes to Electronic/Semiconductor manufacturing. High yield manufacturing process will drive production. We look for an industry standard on establishing first pass yield criteria. Substrate flatness and stencil to PCB gasketing will be driving production. Rapid Tooling will continue to provide tools to ameliorate warpage, ensure support and reduce operator subjectivity.
The New Year will be an improvement over 2013.
