FCT Assembly (FCTA) has big plans in store to offer new solutions and technology to our customers in 2014. The FINE LINE STENCIL division will offer a few new products with NanoSlic leading the charge. NanoSlic offers increased transfer efficiency as well as paste release in the aperture. With NanoSlic, users benefit from a large reduction in underside cleaning of the stencil, better print consistency and a highly durable coating.
Also, we offer Root Cause Analysis to our existing customers to help engineer solutions and improve yields. We will identify the root cause of yield problems during the assembly process. This will include accurate and thorough analysis based on assembly and process variables as well as detailed analysis reports and recommendations. On the solder paste side of the business, we will be coming out with a new Tin/Bismuth alloy for low temperature soldering. This robust technology will provide excellent electrical resistivity and very low voiding BGA solder joints.
Looking forward, our focus will be to develop a line of solder pastes that solves tomorrow's issues. One issue we are focused on is the development of pastes that reduce graping. FCTA will roll out a line that essentially eliminates this issue. In addition to reduced graping, features of our solution driven solder paste lines include low voiding, low melting, anti-tombstoning and high activity.
Also, we plan to continue with our geographic expansion in North America. Last year we acquired Global Stencil and MRC to help increase our overall stencil manufacturing capacity. We then gained some new capabilities including the ability to produce step and relief stencils. This upcoming year we plan to focus more on Mexico because we see the electronics market growing in North America. We see a lot of business come back to North America from China including the development of LEDs, which should fuel more growth within the next year.
