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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 9, 2014

Andy Dolan, Global Business Development Manager, AIM

Cogiscan has been growing rapidly over the past year and we expect this trend to continue and even accelerate in 2014. We see increased demand for Track, Trace and Control solutions from all segments of electronics assembly. We have several major corporate deals for which we need to implement our system in multiple sites in 2014. To support this growth we are planning to hire additional resources throughout the year, mainly in software development,application engineering and technical support.


In 2014 we also will introduce several new products that will have a significant impact on our customer's bottom line. Companies are investing in this type of software system to optimize existing operations and reduce costs through real-time visibility and reporting, error-proofing and traceability. We look forward to a very exciting year in 2014.

Andy Dolan
Global Business Development Manager, AIM
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling