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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 10, 2014

Dave Tacelli, Chief Executive Officer and President, LTX-Credence

One of ACE's greatest differentiators is that from our inception we've been a leader in selective soldering technology. Among our recent innovations is the development of a nitrogen hot air knife for fine pitch through-hole soldering, selective soldering of large backplanes up to 28" x 36", an embedded temperature data logger for greater thermal control of the selective soldering process, and a maintainable drop-jet flux dispenser that can process water-soluble, rosin-based and high solids content flux chemistries.


As part of our commitment to customer service, we have expanded into the Asian market during this past year to enhance our ongoing relationship with our worldwide customers. Throughout the upcoming year we will maintain our strong investment in R&D so we can continue our reputation of delivering award winning technology, and our highly successful series of selective soldering workshops, to help solve our customer's most challenging selective soldering processing needs.


Our outlook for 2014 is optimistic since the market response to our product offerings has been overwhelming with a big uptick in machine orders at the end of 2013.  We anticipate this positive sales trend to continue in 2014 as the demand for selective soldering technology remains strong for the foreseeable future.

Dave Tacelli
Chief Executive Officer and President, LTX-Credence
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling