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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 14, 2014

Steve Zweig, VP Sales, Glenbrook Technologies

Closing the year with great momentum and one of the greatest order backlogs ever for the electronics division, we are looking forward to a very positive 2014. With several new product launches in the Printer, Handling and Laser product portfolios we are enhancing our product offering for our customers who expect leading edge technology and innovation.


At APEX we are releasing the brand new SERIO 4000 Printer platform, which has already excited European customers with the SIMPLEX HMI and new product setup in less than 2 minutes. With a long list of on-board options customers will quickly realize the value proposition.


The INSIGNUM 4000 laser marker will be coming out with a new feature that automatically determines the fastest way to mark several codes on a multi-up panel, to shave off up to 50% cycle time.


The biggest push however will be coming in the Handling segment: the launch of the "Mobile Line Assist" is scheduled for 2014. This innovation is an industry first and enables the user to not only monitor but also control an entire production line via a tablet, thus enhancing the operator's awareness of the line status and the next required intervention.


With solid innovations and a growing service team in the various regions throughout the Americas we are well prepared to support our customer's growth in 2014.

Steve Zweig
VP Sales, Glenbrook Technologies
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling