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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 15, 2014

Malcolm Montanjees, President, Equipment Services

Following a very successful 2013, Zero Defects International will continue to emphasize the unique features and benefits associated with our principals and partners who manufacture test and inspection equipment for the PCBA industry. In every case there are particular technical and operational items which provide competitive advantages and offer higher value to the user.


Additionally, several new products will be added to our portfolio in January. These are products that complement our existing PCBA test and inspection equipment and are quite new for specific applications.


Finally, 2014 promises to be a good year because the economy will gain more strength overall and domestically the electronics industry will further benefit from the ongoing move to more onshoring. The combination of these two factors is positive for the entire industry.

Malcolm Montanjees, President, Equipment Services LLC
President, Equipment Services LLC
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling