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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 16, 2014

John Arena, Marketing Manager, Teradyne, Inc.

Japan Unix celebrated 40th anniversary in 2013 and thanks to the business recovery in the world, we achieved a rapid business growth in 2013. We have opened a technical service center in Mexico, Guadalajara, to provide better service to our regional customers. Also, we've launched full automation soldering system, UNIVERSE, which is highly demanded by automotive manufacturers.


Japan Unix has been enjoying its global leader position in soldering automaton with robotic engineering. Due to the computerized society today, every industry is turning into electronics. Our technology is highly required by manufacturers, who want to automate their soldering process. Meanwhile, the production demands are much more complicated, since their requirements such as higher speed, more amounts, thinner and denser shape.


Our differentiator is the combination of qualified soldering modules and robotics engineering. We established a laser soldering method to meet manufacturing demands. The prediction in 2014 is that production requirements will be continued and will become even tougher. Japan Unix is continuously to provide high-end electronics assembly solutions and is planning to offer two new soldering products applied with innovative technologies and new methods. In order to know more about us, we are welcome you at the APEX Show in Las Vegas.

John Arena
Marketing Manager, Teradyne, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling