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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 17, 2014

Phil Szypko, Vice President, Sales & Marketing, Alpha 1 Technologies

Our unique "Best Practice Lean NPI flow", represents the most accurate, rapid and cost effective design through manufacturing and assembly process. Valor's supply chain enhancement tools also bring unique lean enhancement to supply chain
operations.


Together, these solutions represent our differentiated technology providing essential control for design, manufacturing and assembly to meet whatever challenges 2014 may bring.We feel that there are plenty of opportunities in the Electronics Manufacturing market, and we will continue to focus our efforts on enhancing our solution in ways that address our customer needs.


We've been experiencing positive momentum in the market and we intend to continue
developing it by releasing new products and new versions.


The growth of internet sales, direct shipping, and increased product variants fuel new market expectations for enhanced factory response to short-term demand fluctuation. This trend is behind "Industry 4.0," the principles of which are already a major part of our unique solutions available today. The ability to quickly and efficiently adapt to demand changes is critical--creating a clear benefit for our customers by enabling them to
take  advantage of growth opportunities in this coming year.

Phil Szypko
Vice President, Sales & Marketing, Alpha 1 Technologies
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling