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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 20, 2014

Eric Hassen, Vice President and General Manager, Saline Lectronics

Consumers' appetite for smaller, higher functioning communication devices continues to grow. And, while manufacturers have the capability to deliver increasingly miniaturized components, the challenge is to produce these devices economically, efficiently and at high yield. Miniaturization alone -- while complex -- isn't what presents the greatest obstacle. It's balancing the requirements of miniaturization with "standard" technology to achieve robust broadband (heterogeneous) assemblies that challenges electronics specialists. This has been and continues to be what inspires DEK's product and process innovation efforts.


Driven by these market realities, DEK will launch several new technologies this year which will make highly accurate, high-speed print processes more efficient and easier to use. Our approach to customer partnerships in 2014 will remain as it has since DEK's founding over 40 years ago: we will exceed customer expectations in all aspects of our global business and will continue to invest in innovative, exceptionally accurate printing solutions -- from the market's best platforms to unique productivity enhancing systems to precision screens and stencils.


In 2014, DEK expects global expansion in the markets we serve. Semiconductor packaging and electronics assembly will see modest growth and solar cell demand is reaching manufacturing capacity levels, which bodes well for future equipment investment. Our pending acquisition by ASM Pacific Technology is very exciting and presents many new long-term growth opportunities for DEK. With our new ownership and our exceptional customer partnerships, we look forward with great anticipation to an excellent 2014.

Eric Hassen
Vice President and General Manager, Saline Lectronics, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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