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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 20, 2014

Frank Hart, Global Sales and Marketing Manager, PVA

Enthusiastic about the exponential growth Saline Lectronics experienced in 2013, we head into 2014 optimistic about sustaining this growth, and even expanding further into our target markets including medical, oil and gas, aerospace and telematics products.


Due to our commitment to flexibility and emphasis on a customer-centric environment, we continue to accommodate demanding delivery schedules and last minute design changes. Electronic contract manufacturing at its nature is a reactive business; however, we have kept our customers fulfilled by offering proactive solutions throughout the manufacturing relationship.


Our continued investment in the latest manufacturing equipment, hiring and training talented staff, and expanding on our process capabilities will allow us to support the continued growth we have planned for 2014. We are prepared to tackle additional volume, and anticipate assembling challenging product designs both at the circuit board assembly and box-build levels.


Personally, I am very encouraged by the latest re-shoring initiative taking place on a global scale, and even experiencing firsthand some of our customers returning from offshore. It's exciting to visualize major American companies returning to the US to manufacture their products. It's our hope at Saline Lectronics that some, or even many, of these companies choose us to assemble their circuit board products.

Frank Hart
Global Sales and Marketing Manager, PVA
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling