circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 21, 2014

Rob Boguski, President, Datest

This is an exciting time at PVA. We conclude 2013 with continued growth as demand for our core automated dispensing and selective coating solutions remains high. One year ago we projected strength in the North American market and a commitment to acquiring market share in Europe and both have materialized. Increased demand for process customization has spurred this growth and has allowed PVA to differentiate ourselves in the marketplace as an engineered solutions partner.


Strategically, 2013 was a year of transition for PVA. Much work has gone into our plans for the future and many of these efforts will be executed in 2014. Specifically, we have committed to redesigning our product line in what will result in PVA's most aggressive launch in over a decade. This initiative will be unveiled on March 25, 2014 at the IPC APEX Expo.


Additionally, PVA has continued to invest in Europe, a key growth market for our products, by opening a technical center and spare part warehouse in Paris, France. We will also open another service center on the continent in Q1.


Lastly for 2014 and beyond, we are seeing demand for process development and optimization
from our customers and foresee increased involvement as partners to proactively improve their manufacturing efficiency.

Rob Boguski
President, Datest
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling