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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 22, 2014

David Raby, President / CEO, STI Electronics

MIRTEC continues to set the standard for technological advancements within the Electronics Inspection Industry. It is MIRTEC's unwavering commitment to R&D combined with an aggressive technology roadmap that sets us apart from our competitors.


MIRTEC is persistently focused on new product and new market development. In 2013, we introduced our revolutionary OMNI-VISION 2D/3D Inspection Technology allowing MIRTEC to establish its leadership position within the highly competitive Automotive Manufacturing Industry.


This same technology is now available with our LED and semi-conductor inspection solutions. In 2014 MIRTEC will continue to develop new products which will allow us to capitalize on opportunities in complementary inspection markets.


MIRTEC invested heavily in human resources throughout 2013. That being said, there are still some key positions which we are looking to fill in the upcoming year.


Due to continued global economic uncertainty, I believe that our industry should expect to see the same slow and steady growth throughout 2014 that we experienced in 2013.

David Raby
President / CEO, STI Electronics, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling