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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 22, 2014

Dr. Frank Bose, CEO, Essemtec Switzerland

I'm looking forward to good things from STI Electronics in 2014, our 32nd year.


STI Electronics added a lot of talent to our manufacturing side at the end of 2013 and with that investment; I look for us to continue to improve our quality and efficiency on low and medium volume production throughout 2014 as a result. Our training department will continue to be the leader in IPC training and certification with the industry's best instructors and facilities.


Our new training center will open in Houston in January and offer most of the same classes as currently offered in Madison taught by full time STI instructors. We also are teaming with other organizations to offer other classes in both locations to the industry which complement the current offerings.


Our product distribution department will continue to make the buying experience easier with new catalogs and a new web site. We also will team with our like-minded suppliers to add value to your commodity purchases.

Dr. Frank Bose
CEO, Essemtec Switzerland
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling