Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 23, 2014

Anna Prolejko, Head of Business Development, Assel Sp. z o.o.

2013 was a record year for Speedprint. Our 2014 plan will raise the bar on last year's performance as we continue to drive towards our long-term growth plans. As has been the case in the past, our success can be attributed to the value Speedprint offers our customers.

We will continue to promote and enhance that value message in 2014 through new product innovation that will be on display at the 2014 IPC APEX Expo. These new design innovations will add flexibility within the confines of the print platform, increase productivity as well as further reducing the operational and ownership costs for our users.

Anna Prolejko
Head of Business Development, Assel Sp. z o.o.

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura