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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 27, 2014

Anothony Ambrose, President & CEO, Data I/O Corporation

ACD will continue to push forward as the industry leader in Package On Package (POP) Technology, focusing on the medical and military markets. As a part of this ACD will continue to expand our test development capabilities.


ACD will be expanding our Electro-Mechanical/Box Build area, both in terms of hiring new employees and facility expansion. Electro-Mechanical production will include end-customer logistics including installation and RMA support.


We anticipate that 2014 will be a much better year for the EMS industry. There has been a significant increase in activity in the high mainstream technology areas, which is an area typically hit first in a down turn. We also see the exodus from China continuing helping the Mexico and US markets.


W. Scott Fillebrown, President & CEO of ACD, became a stockholder in January 1995. Starting with ACD after college, he has a total tenure of more than 24 years with the company. He graduated from the University of Texas - Dallas in 1989 with a B.S. in Business Administration with a concentration in Marketing. Currently, he is responsible for the company's finance, manufacturing operations and marketing efforts. Scott's out of the box thinking towards manufacturing has led ACD to win numerous awards for revenue growth and technology advances.


Founded in 1984, ACD is a full service EMS company. The company's services comprise complete board layout, DFM/DFA capability, printed circuit fabrication, component procurement, thru-hole, SMT and part-on-part mixed technology assembly, box build, rework, flying probe, functional and JTAG test, and development. For more information, visit www.ACDUSA.com.

Anothony Ambrose
President & CEO, Data I/O Corporation
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling