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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 27, 2014

Dan Romani, Business Director - Petroferm Cleaning, Petroferm

2013 was an exciting year for Data I/O. With a renewed focus on our core business and made several changes to support our strategy of innovation in the core programming business. We hired a new CTO, Rajeev Gulati, to guide our development of new products.


In September 2013 Data I/O introduced the award winning PSV7000 automated programming system and was premiered at Productronica in November. We also expanded our customer base with exciting wins in consumer electronics.


Customers around the world in wireless, automotive and consumer electronics markets are demanding the highest quality programming at lower costs. With industry leading throughput, capacity, small parts handling, and versatility, the PSV7000 delivers on these demands and cuts the total cost of programming by up to 50%.


In 2014 we will continue to see files sizes grow exponentially, device density to increase and package sizes will shrink. Our end markets of wireless communications, automotive electronics and consumer electronics all will grow their programming needs. At the same time, customers will face higher quality requirements and continued cost pressure.


Data I/O will continue to build on our momentum from 2013 with relentless focus to deliver programming solutions that are more cost effective, easier to use, and more secure.

Dan Romani
Business Director - Petroferm Cleaning, Petroferm
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling