In 2013 we introduced our new convection reflow platform, the DYNAMO�. The DYNAMO is designed specifically for portable electronics manufacturers where the pressure for cost reduction has been acute. The DYNAMO features an innovative convection system that simplifies the oven design and delivers the reliability and performance that BTU is known for.
The DYNAMO has enjoyed considerable early success with both multi-unit and follow-on orders coming from key customers. We are still investing in this new platform and have a number of exciting new features planned for release this year.
Our award-winning PYRAMAX(TM) reflow oven continues to set the benchmark for performance in the industry. There is no reflow oven more popular with the semiconductor assembly test suppliers (SATS) than the PYRAMAX. We continue to improve the PYRAMAX and plan to keep it the best performing oven for years to come.
In 2013 we launched an upgrade program aimed at saving operating costs and enhancing productivity for existing customers. Among others, customers can benefit from our latest generation furnace controller, the INTELLIMAX2, an incredibly powerful, scalable and flexible control platform which delivers additional process optimization capabilities.
While the electronics market is our key focus, unlike many of our competitors BTU is involved in multiple markets and applications. Our expertise is not limited to the typical curing and reflow temperatures at or below 400�C, we build equipment for diverse industries- some with maximum temperatures in excess of 1800�C. We continue to invest heavily in R&D with an emphasis on developing technology that will further enable our customer's success.
