circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 31, 2014

Tetsuro Nishimura, President, Nihon Superior

2013 was an amazing time for Pickering and our specific markets in test. Sales in the US and Asia grew substantially and for many reasons. Pickering has been very proactive in addressing the needs of customers in Switching for test. We have introduced a substantial number of new products in the past year.


Our product introductions are based on customer requests, but equally important is our focus on "Mass Customization". In other words, we believe that one size does not fit all, be it a laptop computer, automobile, or even a switch module.


By offering many configurations of a module design, and also keeping in mind switching density, we can provide just enough test for our customer's budget. For example, if you only need to switch eight RF signals, why should you buy a module that supports sixteen channels? Test Engineers need to balance their test requirements based on specifications, budget and even size!


In 2014, we will continue to pursue our Mass Customization strategy with a focus on tools to make it easier to select Pickering for our customer's next test system. With so many choices, we need to help our customers find the right module and configuration quickly.

Tetsuro Nishimura
President, Nihon Superior
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling