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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 4, 2014

Ernie Grice, VP Sales, Kurtz Ersa North America

2013 was an exciting year within the electronics assembly group at OK International. We consolidated our entire electronics product offering, including Oki branded products, under the globally renowned brand Metcal. The latter move now extends the value proposition of the Metcal brand to address the full spectrum of the user base, from cutting edge application solutions to the more cost conscience consumer.


Several new products made their debut in 2013, including a hot air pencil addition to our hand held convection line and a new and improved MX-500 soldering system.


Following industry IC unit forecasts and close communication with our global customer base, we continue to hear that 2014 will be a positive year to 2013. Our 2014 product releases are directly aligned to offer solutions to challenging application that were largely borne from collaboration with our global customers.


Metcal took the industry a step forward with our very popular Scorpion advanced package rework system in 2013. Look for Metcal to push the envelope of technology further as we add to the latter product group in 2014.


2013 saw Metcal extend its reach into three new countries, taking our sales and service channel footprint to more than 52 countries. Several key hires came on board from global applications engineers as well as additional talent to deepen our engineering capability. We enter 2014 full steam ahead and ready to take the next steps forward with current and new customers.

Ernie Grice
VP Sales, Kurtz Ersa North America
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling