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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 5, 2014

Erhard Hofmann, Owner, AdoptSMT

We at VJ Electronix have an optimistic outlook for 2014. We just wrapped up a challenging year with conservative investment by most customers, especially in China.  But we are seeing many signs of improvement worldwide.


Ongoing demand for social media and connectivity have fueled activity related to servers and web infrastructure. Our Summit rework and Vertex X-ray inspection systems are particularly well suited for these applications. PTH connectors used for memory modules require a low-cost off-axis inspection solution. The large sized, high value boards used require very tight process capability for rework.


Growth in hybrid and electric cars, and storage for green energy will drive battery manufacturing and a wide range of assemblies used for power management. We see this as another great opportunity for 2014 and beyond.


We will soon introduce the next generation of our Summit platform. We have combined the latest in controls and system advances from our Micra rework system with the horse power and durability of the Summit 1800.


Our Vertex X-ray will now feature the latest in high contrast, high resolution digital detectors at a very attractive price point. Combining these detectors with off axis inspection provides a greater range of programmable inspection capabilities to address the new challenges headed our way.

Erhard Hofmann
Owner, AdoptSMT
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling