circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 7, 2014

Graham W. Norman, Managing Director, EVS International

Practical Components expects to continue our worldwide growth in 2014. We have seen a solid increase in the adoption of our technologies because of the enormous cost savings that they produce and the improved production quality levels that they achieve.


In the last year, we saw a number of new products that we will continue to develop in the coming year. In our lineup of new components are the Amkor eWLP and the CSPnl wafers, .3mm pitch CVBGA, and the WLP. We continue to see a wider adoption of the Amkor TMV(R) PoP as well as our other advanced components.


We have expanded our offerings of evaluation PCBs to include Jabil selective/wave solder boards as well as a Jabil solder paste evaluation board. All of our evaluation and hand solder kits represent a significant source of savings for our customers and have strong ongoing demand.


Our new 2014 catalog is now shipping and is designed to simplify the rapid deployment of advanced technologies and hand solder training kits to train and evaluate employee skills.

Graham W. Norman
Managing Director, EVS International
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling