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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 7, 2014

Colin Longworth, Managing Director, DKL Metals Ltd.

In 2014, we intend to continue to provide the very best payback (ROI) in our industry and continue to combine this with first-class support to our customers. Also, are launching our latest and most flexible product -- the EVS 500, will be a step up in volume for our range of products with a great ROI and smaller carbon footprint.


We expect the recovery to continue in 2014 as Europe overcomes its problems and turns the economic corner. Once Europe turns, it will help stimulate the rest of the world as it is the biggest trading area.

Colin Longworth
Managing Director, DKL Metals Ltd.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling