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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 12, 2014

Dr. Max Larin, CEO, XIMEA Germany

2013 continued an amazing run of growth and expansion at DfR Solutions. We continue to be seen as thought leaders in electronics design, manufacturing, and reliability.


In addition to our core customers, we experienced a tremendous amount of activity in rapidly growing markets, such as hybrid vehicles, solar, light emitting diodes, and MEMS packaging. In addition to the demand for our consulting and lab services, we are excited about the surging interest in our Automated Design Analysis software, Sherlock.


We effectively doubled the number of sales and we project to double the number of sales again in 2014. Our success is being driven by impressive improvements in the software capabilities, including automated thermal derating, pad cratering prediction, and full 3D capabilities.


Visibility of the software is also rising due to key relationships with Simulia and Mentor Graphics and the expansion of modeling and simulation requirements in a number of key vertical markets, including automotive, aerospace, military, and down-hole.

Dr. Max Larin
CEO, XIMEA Germany
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling