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If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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February 13, 2014

Farouk Eshragi, V.P. Manufacturing Test Systems, Acculogic Inc.

After more than 20 years in business people learn how to predict and plan, but still there emerge things which can surprise because that is the way of life. XIMEA managed to adapt in last few years to the constant change and fluctuation in the market.

Year 2013 was full of positive developments in different directions. Therefore it is so pleasant to say that we are looking forward to what 2014 will bring.

In 2013 new facilities were built, many people right for the job were found, positive cash flow raised and highly anticipated products released. With new stock and partners all over the world the company is moving forward with heads held up high. The main challenge is set to keep the stability of growth.

Threats and issues are recognized and our teams are equipped with tools and expertise to resolve them.

Main challenges that our customers tackle is the miniaturization of applications and their overall speed. This is critical for processes in general as well as their implementation, management or support. The differentiation is key and being able to customize and build OEM products for specific customers helps a lot. Our strongest principle is that not the price fight should win the overall game.

Because of all mentioned above XIMEA released new products which are smallest, fastest,
built incorporating latest technology like USB 3.0 and include the option to be customized for the needs of customer. Additionally our approach keeps its fundamental nature of being compatible- with different software or hardware, with partners or even competitors. Hence XIMEA products tend to be used in original ways and latest technological advancements.

Important part is also to constantly extend the range of offered products which now includes cameras with CCD sensors from Sony and Truesense or CMOS sensors from CMOSIS, e2V, Onsemi and Aptina. Their reliability is ensured by proven Firewire or USB 2.0 interfaces and by advanced standards like USB3 Vision or PCI Express.

In 2014 our plan is to enhance present software support of Windows, Linux, Mac OSX with new features and increase the mass production capacity.

Farouk Eshragi
V.P. Manufacturing Test Systems, Acculogic Inc.

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
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