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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 14, 2014

Peter Vigneau, VP & General Manager, Circuit Technology Center

Moving on to 2014, SMTI looks forward to new all of the new challenges that our customer-partners can give us. We feel that there are plenty of opportunities in the electronics manufacturing market, and we will continue to focus our efforts on enhancing our manufacturing solutions in ways that address and exceed our customer expectations.


SMTI offers many disciplines: PCB Assembly, Wire and Cable Assembly, Complete Box Build, and Press Fit Mother Board assembly all under one roof.


We see the ability to quickly and efficiently adapt to technological and business climate changes being crucial in creating a clear benefit for our customers by enabling them to take advantage of their own growth opportunities in this coming year and in the future. The trend toward increased product variation fuels new market expectations resulting in the need for faster factory response at a lower cost, yet with the highest quality.


Finally, SMTI will add new processes and automation to our production floor in 2014, as well as focus on continuing employee education. This equipment and education will complement and improve our existing processes and quality no matter what customer challenges are presented to us.

Peter Vigneau
VP & General Manager, Circuit Technology Center
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling