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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 6, 2015

Gil Zweig, CEO, Glenbrook Technologies

In 2015 we expect to see a continuation of the trends towards cost reduction and increased traceability. At Cogiscan we believe that these two seemingly contradictory requirements are actually two elements of the same journey towards a factory-wide Track Trace and Control (TTC) solution. We are widely recognized as the industry experts in this critical area but we need to keep pushing the technology in order to maintain our leadership and to continue providing a competitive edge to our customers.

We will be introducing several new products and features in 2015. We will also continue to expand our global footprint through international key accounts and local channels. We expect to add several employees again next year to support our growing customer base.

We expect that the overall economy will remain healthy but manufacturers will continue to be cautious with capital spending. Instead of buying new lines to add capacity they will be investing in software tools to get more production from existing assets.
Gil Zweig
CEO, Glenbrook Technologies
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling