Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 7, 2015

Thomas Wenzel, director of the Boundary Scan division, GOEPEL electronics Jena

Glenbrook Technologies' patented high resolution x-ray imaging technology has brought to the electronic assembly market reliable, affordable, precision x-ray imaging.

Because this imaging technology combines, for the first time, high resolution real-time x-ray imaging along with low radiation dose, it is being discovered for use in critical life science research such dysphagia and cochlear implant research and used by such facilities as the FDA, CDC, University of Missouri, NYU and Columbia Schools of Medicine.

The advancements in our technology from these applications will serve to benefit the electronic assembly market by making our systems even more reliable, affordable and precise.

Thomas Wenzel
director of the Boundary Scan division, GOEPEL electronics

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura