Glen Thomas, Solder Paste Product Manager, Indium Corporation

In 2015 the Boundary Scan division of GOEPEL electronics will continue to push the ESA (embedded system access) technology further. It is the only holistic approach in the market to overcome the access problems connected to high complex electronic products and this position will be strengthened by offering customers even more efficient tools for test, debug, validation and programming.

In this respect we plan over 20 new product innovations and support of new standards for the next year. One special focus will be on test and validation of high speed I/O (HSIO) using advanced GBit links on the base of FPGA embedded instruments and automated BERT (Bit Error Rate Test). In total, we want to achieve a greater coverage of our technologies for various applications.

We look to the future with optimism. We expect further economic growth and increasing demand for our innovations and products in important expanding markets such as medical, automotive or telecommunications.

From this point of view we want to continue the organic growth we have since 23 years. In parallel we aspire extending our worldwide network of cooperation and partnerships to establish GOEPEL electronics as a global platform of innovativeness in the embedded T&M instrument market.