Zach Shook, Operations Director, Count On Tools, Inc.

2015 is anticipated to be a period of protracted growth and development for the electronics assembly industry. As always, reduced costs and increased densification remain constants. Consequences of these challenges include reduced feature size (continued miniaturization), increased heat production, more double-sided designs, and increased use of die and package stacking. Customers will face new levels of assembly challenges, including nuanced defects, as well as opportunities to further optimize their processes.

Indium Corporation will soon release exciting new soldering products that address these assembly challenges and help our customers reduce costs, optimize profits, and enhance their brand.

Process Optimization: For high-cost, high-reliability customers, a high-end probe-testable solder paste will be offered in multiple product configurations. This product, suitable for various assembly styles, offers extremely-high product reliability. Indium Corporation will also offer the next generation of enclosed head printing to advance the state-of-the-art processes - developed with key customers.

Materials: Indium Corporation will introduce a high-temperature Pb-free soldering system (fluxes and alloys) in 2015. Additionally, we will introduce a solder paste that reflects the new level of defect sensitivity that results from the current level of component miniaturization. Specifically, our new product addresses both the quality of the flux residue and the voiding level.