circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 9, 2015

Mike Konrad, President, Aqueous Technologies

Teradyne pioneered multi-site test technology in their semiconductor test platforms to test multiple die and packaged parts in parallel. In 2014 we introduced that feature into our production board test systems, increasing system productivity 2-4 TIMES that of conventional systems.

That revolutionary technology delivers reduced test time and higher ATE productivity, ideal for makers of high volume boards and panels striving for lower cost. We will continue to enhance this technology to help manufacturers lower their recurring cost of test in 2015.

We're planning more new models and options that further benefit operating cost, improve productivity and increase customer system utilization. We see an increased need for these products particularly in automotive, consumer and server applications.

2015 will bring fresh challenges in electronics manufacturing. Reduced growth and higher wage costs threaten the competitiveness of China PCBA manufacturing. On the flip side, Mexico appears to be a manufacturing bright spot next year, particularly for US destined electronics.
Mike Konrad
President, Aqueous Technologies
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling