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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 13, 2015

Rachel Miller-Short, Global VP of Sales, Photo Stencil

2015 could be a very good year for electronic manufacturing in North America. The industry metrics are very strong for both 2015 and 2016; potentially as good as the growth numbers in the mid to late 1990's.

My companies each had great years in 2014 and our projections for growth for the upcoming year looks even stronger. We are seeing numerous on-shoring along with expansion in Mexico.

Technology is continuously evolving and there are numerous consumer products being developed. We are seeing "Wearable Technology" and many of the R&D projects are local.

Many of these products will eventually end up manufactured in lower wage markets, but the beta products are being built in N. America.
Rachel Miller-Short
Global VP of Sales, Photo Stencil
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling