circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 13, 2015

Rod Howell, Chief Executive Officer, Libra Industries

2015 will bring the opening of Photo Stencil's new "clean" facility in Golden, Colorado with class 100, 1000, and 10,000 cleanrooms for our stencil manufacturing. This will allow us to ensure the cleanliness of our products throughout the entire manufacturing process as well as give us key manufacturing differentiators to not only meet, but exceed current industry requirements.

In addition, we will be introducing new products, expanding into new markets, hiring new employees, and continuing in our research collaborations and R&D efforts to ensure the best printing result for today's more complex boards and requirements. We are seeing and expecting about 15% growth for us as a company in 2015, which is about 10% higher than the percent the general industry is forecasted to grow in 2015.
Rod Howell
CEO, Libra Industries
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling