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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 15, 2015

Max Larin, CEO, XIMEA Germany

TopLine is adding more production capacity for our CGA - Column Grid Array packages. We see growing momentum of customers asking to replace BGA solder balls with CGA solder columns. Customers are looking for solutions to increase reliability for 1000 to 2000 I/O array packages.

Over wide temperature swings, standard BGA solder balls tend to delaminate from large area array packages. Solder columns are compliant and absorb CTE mismatches due to the inherent physical properties of materials used in large ceramic modules when connected to epoxy-glass PC boards.

Forward looking, 2015 will be a growth year at TopLine. The exclusive agreement that we signed with NASA last year to license Micro-coil Spring technology will bear fruit in 2015. Micro-coil Springs have been tested in the lab to absorb 50,000-G shock, which outperforms standard solder ball technology many times over.

In addition, TopLine will start sampling a new type of tall copper plated solder column that a facilitates enable interconnections down to 0.4mm pitch.

Max Larin
CEO, XIMEA Germany

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura